GlobalFoundries: Agreement with TSMC to Establish US Manufacturing of Silicon Interposers for Advanced AI Packaging!
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GFS will manufacture silicon interposers for AI chips in the USA for TSMC. The agreement alleviates global shortages in advanced CoWoS packaging. The company strengthens its position in the profitable advanced packaging market. Transition to Integrated Ecosystems GlobalFoundries (GFS) has established itself as a pure contract manufacturer but is increasingly transforming into an integrated technology partner. The company is focusing more on the demands in the automotive, IoT, and artificial intelligence sectors. In the second quarter...
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