LG: Entry Into the key Technology for AI Chips!
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LG Electronics is advancing its strategic realignment in the technology sector and is working on the development of its own hybrid bonder system for high-bandwidth memory (HBM). This advanced interconnection technology is considered a key component for the manufacture of high-performance AI chips and represents a promising step towards semiconductor equipment and B2B technology solutions. The system is being developed at the company's in-house production engineering institute, which already has expertise in substrate packaging and verification systems....
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