TSMC: Xiaomi Relies on 3-nm Manufacturing for Foldable Flagship with Xring O3

Xiaomi has introduced its new smartphone processor "Xring O3," which is manufactured using TSMC's advanced 3-nanometer technology. By producing Xiaomi's upcoming foldable flagships, TSMC reinforces its dominance in the high-end segment. In July, revenues surged by nearly 45% to a record. The 3-nm technology is a significant growth driver, contributing 30% of total wafer revenue.   Taiwan Semiconductor (TSM) is reportedly gaining another prominent client for its state-of-the-art 3-nm manufacturing as the world's largest foundry. On...