Süss Microtec as a Key Supplier! OpenAI Deal with SK Hynix and Samsung Indicates HBM Supercycle!
OpenAI is requesting from SK Hynix and Samsung more than double the number of DRAM wafers per month compared to current industry capacity.
Order intake for bonders at Süss Microtec is expected to rise in the coming quarters!
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OpenAI signed a letter of intent with SK Hynix and Samsung for the procurement of 900,000 DRAM wafers per month. According to SK Hynix, this deal means that the HBM demand from OpenAI alone corresponds to more than double the current HBM industry capacities. The roadmap is clear: memory chip manufacturers will need to expand their capacities as demand from inference is skyrocketing. Süss Microtec (i) is a provider of temporary and hybrid bonding machines, which are necessary for the production of HBM. For instance, temporary bonding is required...
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