AT&S: In the Midst of the Substrate Boom - Thanks to the AMD Partnership, the 2026/27 Outlook has been Raised to 45 to 55% Growth!

Because the classic Moore's Law is reaching physical limits, chip designers are increasingly turning to Advanced Packaging. In this process, multiple computing cores are interconnected in a very compact space—a process that necessarily requires complex high-end IC substrates as a medium for connection. The AI substrate acts as the nervous and vascular system that holds the actual AI chips together, powers them, and allows them to communicate with each other extremely quickly. To meet the global demand surge for production, AT&S has now made extensive...