Kulicke & Soffa: How the Company is a Winner of the AI Boom with High-Precision Bonding. New Leader Stock!
Reading Time: 2 minutes
Kulicke & Soffa (KLIC) is active in the field of semiconductor packaging and electronics assembly. The company specializes in high-precision bonding processes that are essential for the physical connection of chips. To meet the extreme demands of modern AI accelerators and HBM, Kulicke & Soffa relies on innovative fluxless thermocompression bonding (TCB). This technology enables the vertical stacking of memory and logic chips with the highest precision. Thus, Kulicke & Soffa provides the technological foundation to efficiently realize...
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