Micron Exceeds All Forecasts and Envisions a 100 Billion USD HBM Market by 2028. SUSS Microtec Provides the [Tool!]

SUSS Microtec supplies high-precision systems, among other things, for "Advanced Packaging." Core products include temporary bonders and debonders as well as mask aligners. These machines enable the stabilization and precise processing of extremely thin wafers, a fundamental requirement for the production of state-of-the-art microchips. The HBM Turbo: Micron Provides the Stepping Stone SUSS Microtec is currently in the spotlight primarily due to the rapid growth of High Bandwidth Memory (HBM). The latest quarterly figures from the US giant Micron...